PRODUCT & TECH

기술과 비지니스를 융합하여 새로운 미래를 만듭니다.

WET System

반도체의 Packaging 공정의 세정(cleaning), 현상(develop), 에칭(etching),
박리(Strip) 장비 등의 인라인 제품군으로 구성 브로셔다운로드
  • D-E-S, SR Pre-treatment,
    Deflux, Roll 2 Roll
    Basic Specifications - Moving : Horizontal, vertical, inclined
    - Drying : Special air knife + high power air blow system
    - New concept special jig
    - Non-contact processing
    - Double side processing
    - Two stage conveyor
    Application - Patterning of PCB process
    - Up to 0.03*500*500mm
    제품문의 z1c202@sti.co.kr
  • For Wafer & PLP
    Stripper / Deflux - Special air knife(Dual Slit)
    - Non-contact processing
    - High Pressure Spray
    - Large-flow Mixing System / no-load magnetic return
    Etcher (Q-Etcher / Flush / Ti / Cu)
          Developer (DF / TMAH)     - IR Oven Dry System
    - Q-OSC Etching System
    - High Temp Control System
    - Etching Chemical Mixing / Precision levels(concentration)
      control System
    Panel Cleaning
          Acid-Chemical preprocessing Cleaning     - EUV Process Cleaning
       (High M/S / USC / AQJ / Water Jet )
    - High Temp Cleaning System
    Wet Cleaner/DIP Process - High USC Processing
       (Tray and CST Dipping / Micro Bubble Supply System)
    Wafer/PLP Foup Cleaner - High Cleaning System(Hot DIW / Steam / Hybrid)
    Wet Cleaner/DIP Process - Wafer & Glass Side Grinding
    - 2Had & 4Had Grinding
    제품문의 z1c202@sti.co.kr