Reflow & Wet Blast
半导体封装过程中利用热量形成凸点和倒装芯片的设备。
Brochure Download-
- Product Inquiry gj.choi@sti.co.kr
-
Application
- Fluxless Reflow for solder Bump Ball, Cu pillar & CoW Chip Bonding of the HBM
- Vacuum or ATM Reflow System -
Advantages
- Void-free Bump Ball Performance
- Various Temperature Profile (Step & Slope Type)
- Outstanding O2 Density Control(<1ppm) at Every Process
- Conduction & Convection Heating Chamber System
- No Chip Sliding on the Flip Chip Process
- Temp Control : 250±1% (Max.450℃) Real Time Monitoring of Process Wafer Temp.
- Process gas : Formic acid or no Reactant gas
- Process Pressure : Vaccum / ATM Process
- EFEM(2 or 3 Port) : SEMI Standards