Reflow & Wet Blast
다양한 Slurry를 노즐로 분사하여 Wafer 및 Glass의 표면에 있는
Crack 제거 또는 표면처리를 통해 표면조도를 조절할 수 있는 장비 브로셔다운로드
Crack 제거 또는 표면처리를 통해 표면조도를 조절할 수 있는 장비 브로셔다운로드
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Application
- Removal of edge glue on TSV bonded wafer
- Removal of glue on TSV carrier wafer
- Full-cut process for TSV bonded wafer
- Glass edge end polishing and reinforcement(LCD / OLED) -
Advantages
- No chipping/cracking on TSV device wafer
- Process simplify(Edge partial cutting, cleaning process)
- Control of removal rate by vision system(National project)
- Cost reduction compared to mechanical process
- Lower operation cost than mechanical process
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Application
- Removal of edge glue on TSV bonded wafer
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Principle of Wet blast
- Wet blast’s three component : Slurry, DI, Air
- Wet blast’s three component : Slurry, DI, Air
- Eco-friendly process without chemicals
- Suit for thin wafer / thin glass process with low pressure process
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Principle of Wet blast
- Wet blast’s three component : Slurry, DI, Air
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Specification
-Slurry material : Resin / SiC
- Removal area : Bevel top/ Side / Bottom
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Specification
-Slurry material : Resin / SiC